Relying on its own rich experience in the development of automation equipment, as well as the painstaking R&D of laser processing technology and the mastery of the characteristics of semiconductor materials, CHN.GIE takes the lead in researching and manufacturing HGL series advanced semiconductor wafer laser stealth dicing equipment in China, which breaks the international monopoly. After the evaluation by the national authority, it is determined that its "comprehensive performance has reached the international advanced level, and some of which are in the leading position in the world".
