Wafer Die Separator

WDS Series

Wafer Die Separator

Wafer expander is also called wafer expander separator. The wafer after dicing is expanded to increase the gap between independent dies, which is easy to be picked up and packed. After the stealth dicing, the modified layer inside the wafer is stretched by lifting and expanding actions, so that the wafer cracks along the modified layer, forming neat and controllable dicing cracks.

Mechanism characteristics

The expansion height can be adjusted

1

2

3

Film spreading speed can be adjusted

Table temperature can be adjusted

Equipment advantages