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KEY

TECHNOLOGIES

OPTICAL

TECHNOLOGIES

PRECISION CONTROL

TECHNOLOGIE

LASER

TECHNOLOGIES

Mastering the laser technology that matches the laser frequency and wavelength of various materials

The picture is from Weber, Marvin J. (1999). Handbook of laser wavelengths. CRC Press. ISBN 978-0-8493-3508-2.

激光技术

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LASER TECHNOLOGIES

Suitable for all kinds of invisible cutting materials

Independently developed

laser lens technology

High-precision lens processing technology

Make the best focus/defocus lens on demand

Precise refraction

Precise reflection

Precise focus control

Independent design of

laser optical path technology

Optimized optical path design

Efficient and precise focusing on demand Efficient and precise defocusing on demand

Regarding the wafer dicing process, alignment programming in the initial stage of wafer import and accurate control in the dicing process are the key to determine the dicing quality. CHN.GIE ensures accurate and efficient dicing quality planning and process control with unique optical technology.

光学技术

OPTICAL TECHNOLOGIES

Wafer scanning before initial alignment programming

Positioning the dicing depth, generating the wafer surface height information, and providing information for dicing control

Wafer alignment programming is simple, accurate, fast and efficient

· The initial alignment can be completed on a single wafer.

· Confirming the processing focus through coaxial focus

· Adjusting the parallelism between the dicing channel and the dicing axis manually.

· Accurate correction of grain size

· Establishing a variety of processing modes: low power, medium power, high power

· Dicing accuracy is ensured by coaxial X-Y direction independent setting parameters

· Parameter verification mode of single chip automatic machining

Quadruple Optical Monitoring System

The stealth dicing technology of CHN.GIE adopts high-speed real-time monitoring technology to ensure the dicing stability

(a) X-y-axis dicing deviation correction in time

·

· Real-time dicing quality monitor

· Full field-of-view optical monitor

· Real time monitoring of high, medium and low magnification optics

(b) Z-axis monitors the height difference of dicing surface and adjusts the dicing depth in time

精密控制

If lithography and microcircuit processing technology are the soul of wafer, the accuracy control,

stability and efficiency in the process of wafer dicing are the most important key to the success of tens of millions of core circuit chips.

HGL series stealth laser wafer dicing equipment of CHN.GIE, with accurate, efficient and stable core control technology,

truly provides customers with competitive wafer dicing process solutions.

PRECISION CONTROL TECHNOLOGIES

· Precision focus depth control technology

Regarding wafer laser stealth dicing equipment, the control implemented by the system on laser focus is one of the most core technologies. In laser technology and laser light path control technology, general intelligence has reached the world advanced level. However, a highly accurate and stable support platform is required to ensure the effectiveness. CHN.GIE has accumulated rich manufacturing experience and precision control core technology in the application of precision automation production line for many years.

·High-precision large-span

gantry architecture

HGL series products use high-precision air floating gantry platform with a span of up to 500mm, which can easily meet the dicing demand of 300 mm (12 inch) wafer

Moving range 500mm

·Maximum acceleration 3G

The air floating precision driving platform can ensure accurate movement and processing with the maximum acceleration of 3G within the span of 500mm, and ensure high machining accuracy and high efficiency production

·X-Y-Z three-axis precision motion control-(1μm)

The laser focus can be precisely controlled to 1 μm in the x-y-z axises direction, which ensures that the dicing focus is always closely tracked, and ensures the horizontal dicing accuracy of the wafer to be diced and the laser modification depth in the longitudinal direction, so that each dicing can achieve the best effect.

·X-Y-Z three-axis real-time trajectory correction-(1μm)

Initially created real-time monitoring system. Obtaining the best dicing direction, route and the height of the whole route in real time before dicing each route, updates and responds quickly in real time, adjusts the best dicing direction, path and depth, and truly realizes the effect of [perfect segmentation].