The air floating precision driving platform can ensure accurate movement and processing with the maximum acceleration of 3G within the span of 500mm, and ensure high machining accuracy and high efficiency production
·X-Y-Z three-axis precision motion control-(1μm)
The laser focus can be precisely controlled to 1 μm in the x-y-z axises direction, which ensures that the dicing focus is always closely tracked, and ensures the horizontal dicing accuracy of the wafer to be diced and the laser modification depth in the longitudinal direction, so that each dicing can achieve the best effect.
·X-Y-Z three-axis real-time trajectory correction-(1μm)
Initially created real-time monitoring system. Obtaining the best dicing direction, route and the height of the whole route in real time before dicing each route, updates and responds quickly in real time, adjusts the best dicing direction, path and depth, and truly realizes the effect of [perfect segmentation].