Wafer Tape UV 

WUI Series

Description of functions

Using the photochemical reaction principle of the adhesive to ultraviolet, the tape debonding equipment irradiates the adhesive film with ultraviolet to change the adhesive strength and reduce the viscosity, so as to provide appropriate maintenance for the subsequent process.

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It is safe and reliable to remove glue 

Mechanism Characteristics

Drawer type structure is adopted for easy operation.

Equipment Advantages