Suzhou Delphi was founded Set up a R & D team and set up a laser processing R & D laboratory to be involved in the research and development of laser welding, laser cutting and other applied technologies in 3C electronics and semiconductor industries.

Laser stealth cutting technology has been successfully developed and applied to electronic glass cutting technology. The company has passed the ISO9000 system certification.

Start the R & D project of laser stealth cutting equipment used in semiconductor industry, and devote to the research and development of laser stealth cutting technology and equipment for silicon-based semiconductor wafers.

A wafer stealth cutting equipment with independent intellectual property rights has been successfully developed. Start the verification of large-scale wafer cutting process

Continuous verification of wafer cutting process and iterative verification of wafer stealth cutting process Began to provide trial cutting service for prospective customers, and continuously improved and optimized the process through tens of thousands of cutting tests.

General Intelligence officially established The integration of enterprise resources has established the development strategy of the company's diversified and integrated industry. General Intelligence takes semiconductor equipment manufacturing as the main line of development. Suzhou Delphi takes the intelligent manufacturing technology of 3C industry as the main development route.

General intelligent semiconductor wafer laser stealth cutting equipment has been officially released to fill the domestic gap. Start the research and development of laser slotting technology for Low-K wafer products and Low-K wafer laser slotting equipment General Intelligent sells and delivers the first wafer laser stealth cutting equipment Declare a number of invention patents, trademarks and other intellectual property rights related to laser stealth cutting technology

Using laser stealth cutting technology to realize the production and sale of Si strip products for high performance optoelectronic chip coating. Mastered the core technology of laser application from ultraviolet band to infrared band. Complete the layout of the R & D and application system of advanced laser micro-nano processing technology Start the research and development project of SDBG process equipment for high-end advanced memory chip packaging A breakthrough has been made in the research and development of equipment for storage chip SDBG production process, and SDBG trial production projects have been obtained from a number of advanced storage and packaging enterprises. Upgrading of stealth cutting equipment for silicon-based optoelectronic chips

Integrated full-flow Low-K wafer slotting cutting equipment to complete test and stereotyping Verification and finalization of SDBG process equipment-official release SDBG process equipment obtains customer order Start the R & D project of SiC ingot stripping equipment

The systematization of the company has been comprehensively upgraded, laying a solid foundation for regularization, systematization and large-scale development. China's first SDBG equipment with mass production capacity is about to be delivered to customers.