KEY TECHNOLOGIES

Key core technology

Laser technology

LASER TECHNOLOGIES

Optical technology

OPTICAL TECHNOLOGIES

Precision control

PRECISION CONTROL TECHNOLOGIE

Laser technology

Master the laser technology that matches the laser frequency and wavelength of all kinds of materials

The picture is from Weber, Marvin J. (1999). Handbook of laser wavelengths. CRC Press. ISBN 978-0-8493-3508-2.

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LASER TECHNOLOGIES

Various materials suitable for stealth cutting

Self-developed laser lens

High-precision lens processing technology to produce the best focus / defocus lens on demand

Self-designed laser optical path

Optimize optical path design on demand, high efficiency and precision focus on demand, high efficiency and precision defocus on demand

Precise refraction, precise reflection, precise focus control.

For the wafer segmentation (Dicing) process, the alignment programming (Alignment) in the initial stage of wafer introduction and the precise control in the cutting process are the keys to determine the cutting quality. General Intelligence uses unique optical technology to ensure accurate and efficient cutting quality planning and process control.

Optical technology

OPTICAL TECHNOLOGIES

Wafer scanning before initial programming

Locate the cutting depth, generate wafer surface height information, and provide information for cutting control.

Wafer alignment programming is simple, accurate, fast and efficient.

The initial alignment can be completed on a single wafer. Coaxial focus to confirm the processing focus. Manually fine-tune the parallelism between the cutting channel and the cutting axis. Accurate correction of grain size to establish a variety of processing templates: low power, medium power, high power, coaxial XMY Axial Independent setting parameters to ensure cutting accuracy monolithic automatic Machining Parameter Verification Mode

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Quadruple optical recognition monitoring system

The general intelligent stealth cutting technology adopts high-speed real-time monitoring technology to ensure cutting stability.

(a) Xmury Y-axis cutting offset and timely correction (b) Z-axis monitors the difference in cutting surface height and adjusts the cutting depth in time.

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Real-time monitoring of cutting quality

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Full field of view visual optical monitoring

Optical real-time monitoring of high, medium and low magnification

Precision control

If lithography and microcircuit processing technology are the soul of wafers, the precision control, stability and efficiency in the process of "wafer segmentation" are the most important factors that determine the success of tens of millions of core circuit wafers. General HGL series invisible laser wafer cutting equipment, with accurate, efficient and stable core control technology, really provide customers with competitive wafer cutting process solutions.

PRECISION CONTROL TECHNOLOGIES

Precision focus depth control technology

For wafer laser stealth cutting equipment, the control of laser focus is one of the core technologies. The general intelligence in laser technology and laser optical path control technology has reached the advanced level in the world. However, it still needs a highly accurate and stable support platform as a guarantee in order to be effective. General Intelligence has accumulated rich manufacturing experience and precision control core technology in the application of precision automation production line for many years.

High precision and long span gantry structure

HGL series products use high-precision air-floating gantry platform with a span up to 500mm, even in the face of the cutting needs of 300mm (12-inch) wafers.

Mobile range 500mm

Maximum acceleration 1.5G

The air flotation precision driving platform can ensure accurate movement and machining with a maximum acceleration of 1.5G within the span of 500mm, ensuring high machining precision and high efficiency production at the same time.

X-Y-Z three-axis precision motion control-(1 μ m)

The laser focus can be precisely controlled to 1 μ m in the three-axis direction of the X-Y-Z, ensuring that the cutting focus is always closely tracked, ensuring the horizontal cutting accuracy of the cut wafer and the laser modification depth in the longitudinal direction. So that each cut can achieve the best results.

X-Y-Z three-axis real-time trajectory correction-(1 μ m)

It is the first to create a real-time monitoring system, which can obtain the best cutting direction, route and the height of the whole route in real time before cutting each route, update the rapid response in real time, and adjust the best cutting direction, path and depth. The effect of [perfect segmentation] is really realized.

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