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Laser stealth cutting equipment
  • 产品1
    Wafer stealth cutting equipment
  • 产品2
    SDBG process equipment
Single focus wafer laser stealth cutting equipment
Suitable for wafers
4 inches to 8 inches
Wafer thickness
3 μ m ~ 1000 μ m
Number of focus
1
HGL1341 series
Large size single focus wafer laser stealth cutting equipment
Suitable for wafers
4 inches to 12 inches
Wafer thickness
3 μ m ~ 1000 μ m
Number of focus
1
HGL1351 series
Cutting equipment
Suitable material
Device-element
Applied industry
Applied industry
Button 1 "20201229" 101618374
Arrowhead
Single focus stealth cutting equipment
Multi-focus wafer laser stealth cutting equipment
Suitable for wafers
4 inches to 8 inches
Wafer thickness
3 μ m ~ 1000 μ m
Number of focus
1.2.3.4
HGL3341 series
Multi-focus large size wafer laser stealth cutting equipment
Suitable for wafers
4 inches to 12 inches
Wafer thickness
3 μ m ~ 1000 μ m
Number of focus
1.2.3.4
HGL3351 series
Cutting equipment
Suitable material
Device-element
Applied industry
Applied industry
Button 1 "20201229" 101618374
Arrow 3
Multi-focus stealth cutting equipment
Double-focus large-size wafer laser stealth cutting equipment
Suitable for wafers
4 inches to 12 inches
Wafer thickness
3 μ m ~ 1000 μ m
Number of focus
HGL2351 series
2
Cutting equipment
Suitable material
Device-element
Applied industry
Applied industry
Button 1 "20201229" 101618374
Arrow 2
Bifocal stealth cutting equipment
TEL:400-136-9779
Monday to Friday: 9:00-17:00 GMT+8
E-mail:gie@chngie.com
Copyright Henan General Intelligent equipment Co., Ltd.
Yu ICP preparation No. 2020024940
4101970200304141019702003041