ABOUT GIE

Brief introduction of enterprise

General Intelligence (CHN.GIE) is an international intelligent equipment manufacturing enterprise, the core research team is composed of technical experts led by doctors, has a complete modern team of R & D, design, manufacturing and operation management, the company is committed to high-end semiconductors, upstream and downstream industry chain equipment and materials R & D and manufacturing. Since 2007, General Intelligence has carried out the research on laser processing technology and semiconductor material characteristics with the help of multi-site laboratories. At the same time, its engineering team has accumulated a great deal of automation equipment R & D and manufacturing experience in providing contract manufacturing services for world-class brands. The company has built a thousand class dust-free.

The workshop, equipped with advanced instruments and equipment, with advanced technology and strict quality management system, provides a strong guarantee for the R & D, testing and upgrading of semiconductor equipment. In 2019, General Intelligence launched the international leading wafer laser stealth cutting equipment with fully independent intellectual property rights, which filled the domestic gap and broke the international monopoly. The equipment is at the international leading level in terms of key parameters, and has declared 206 intellectual property rights, 55 invention patents, 1 software copyright, 2 appearance patents and 148 utility models. After the expert evaluation organized by Zhengzhou Productivity Promotion Center, it is considered that the equipment is equipped.

With reasonable design, advanced technology and strong practicability, it is the first in China. The performance index and overall level have reached the domestic leading and international advanced, so it has a broad application prospect. Henan General Intelligent equipment Co., Ltd. has won word-of-mouth and trust among peers and customers with the enterprise spirit of "integrity, responsibility, team and innovation". We not only manufacture the world's leading wafer laser stealth cutting equipment, but also provide customers with a full range of process solutions and supporting personnel training services.

The Development of Semiconductor Materials

Since the 1950s, the semiconductor industry has gone through more than 70 years of development. Semiconductor materials have experienced continuous iterations of the first and second generation application technologies, and gradually reached the performance limit in some fields. The third generation semiconductor materials with wide bandgap properties are rapidly expanding their scope of application.

Semiconductor materials (1950s): Silicon (Si), germanium (Ge)

After long-term development of application technology, silicon semiconductor manufacturing technology and microcircuit processing technology have reached close to the optimal level, especially in the fields of computer logic processing chips, low power control chips and so on. Silicon semiconductor products have a mature manufacturing process and still have cost advantages for quite a long time.

With the dominant position of silicon semiconductor materials, the position of human industrial society will not be shaken.

Semiconductor materials: gallium arsenide (GaAs), indium antimonide (InSb), GaAsAl, GaAsP;Ge-Si, GaAs-GaP

Since the 1990s, with the rapid development of mobile communications and the rapid rise of the information superhighway and the Internet based on optical fiber communications, the physical properties of silicon materials have limited their applications in optoelectronics and high-frequency power devices. for example, its indirect band gap determines that it is difficult for him to obtain higher electro-optic conversion efficiency.

The second generation compound semiconductors represented by gallium arsenide and indium phosphide have been applied, mainly for the fabrication of high-speed, high-frequency, high-power and light-emitting electronic devices. it is an excellent material for the manufacture of high-performance microwave, millimeter wave devices and light-emitting devices.

It is also widely used in satellite communications, mobile communications, optical communications and GPS navigation and other fields. Compared with the first generation semiconductor, gallium arsenide (GaAs) can be used in the field of optoelectronics, especially in infrared lasers and high-brightness red diodes.

Amorphous semiconductors: amorphous silicon, glass oxide semiconductors, organic semiconductors

Semiconductor materials (2000 ~): Silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond, aluminum nitride (AlN), etc.

Since the beginning of the 21st century, emerging electronic technologies such as smart phones, new energy vehicles and robots have developed rapidly. at the same time, the global energy and environmental crisis is prominent, and energy utilization tends to low power consumption and fine management. the first and second generation semiconductor materials are difficult to meet the needs of scientific and technological development due to their own performance limitations. The third generation semiconductor materials represented by silicon carbide (SiC) and gallium nitride (GaN) can overcome the inherent shortcomings of silicon (Si), so as to meet the needs of a wider range of industries, especially high-performance sensor industry, automotive electronics, IT high-speed communications, medical, aerospace and so on.

Memorabilia

General intelligence

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Open up the future and continue.

General intelligent wafer stealth cutting equipment comes out to fill the domestic gap in one fell swoop

Wafer cutting process verification: to provide industry users with trial cutting services, through tens of thousands of cutting verification Optimize and perfect the process

Independently develop wafer stealth cutting equipment and declare a number of patented inventions

The stealth cutting technology is mature and applied to the glass cutting company and passed the ISO9000 certification.

The R & D team has set up a laser welding R & D laboratory to get involved in the consumer electronics and semiconductor industries.

Steady management, pioneering and innovation, abiding by honesty and social responsibility

Enterprise concept

Enterprise vision

The world's leading semiconductor high-end equipment manufacturer

Always adhere to customer-centered

Management idea

Service concept

TEL:400-136-9779

Monday to Friday: 9:00-17:00 GMT+8

E-mail:gie@chngie.com