Wafer alignment programming is simple, accurate, fast and efficient.
· Initial alignment can be done on a single wafer.
· Coaxial focus confirms the machining focus.
· Manually fine-tune the parallelism of the alignment cutting channel to the cutting axis.
· Precise correction of grain size
· Establish a variety of mode processing templates: low magnification, medium magnification, high magnification,
· Coaxial X-Y axis independent setting parameters to ensure cutting accuracy
· Single-chip automatic processing parameter verification mode
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