Industry applications

Summary

Since the 1950s, the application of semiconductor technology has greatly accelerated the development speed and quality of human civilization. Semiconductor materials have experienced the development and maturity of the application technology of the first generation and the second generation semiconductors, and the third generation semiconductor materials with wide bandgap properties are also developing rapidly. The semiconductor chip manufacturing process has reached the era of unit nanometers, the chip integration is getting higher and higher, the chip is getting smaller and thinner. The semiconductor packaging industry urgently needs to introduce cutting technology solutions with low cutting stress, high process safety factor, high cutting efficiency and environmental protection.

The content materials come from Julissa GreenPress. Detailed Introduction to the Third Generation of Semiconductor Materials.

Automobile industry

CPU /GPU

Memory

All kinds of acoustic sensors, attitude sensors and pressure sensors represented by MEMS sensors are indispensable core components of all kinds of medical equipment, transportation, communication equipment, and even aerospace and national defense equipment. Different from the traditional IC with closed protective layer, MEMS has extremely fine micro-machining structure, with very precise fishing line, gear, hinge, bridge and diaphragm structure, and the physical structure is usually very fragile. The traditional blade is the water cutting method. All kinds of pollution, vibration, heating and ESD (static electricity) in the cutting process may greatly reduce the performance of MEMS products, and even lead to catastrophic failures that lead to product scrapping. Stealth laser cutting is the best solution for wafer segmentation of MEMS products. Because of its inherent technical advantages, laser stealth cutting can overcome various technical risks of traditional blade cutting and surface laser cutting. Laser stealth cutting can restrain various technical risks in the process of wafer cutting to the maximum extent. Provide the best technical guarantee for the stable mass production of MEMS products.

All kinds of semiconductor sensors

Entering the 21st century, the electrification (EV) rate of cars is expanding rapidly. Hybrid vehicles, plug-in hybrid vehicles, pure electric vehicles and even fuel cell vehicles account for an increasing share of the market. 2035 is designated as the first year of termination of fuel car manufacturing by countries all over the world. Power electronics technology provides reliable high-voltage, high-current and high-power power control system, which determines the performance and safety of electric vehicles. In the process of power conversion of traditional power electronic devices, about 10% of the electricity will be lost due to heat. The third generation semiconductor material silicon carbide (SiC) will greatly reduce the surface resistance (RonA) of electronic components and significantly reduce the straight-through loss. At present, SiC devices are widely used in new energy vehicle power control unit (PCU), inverter, DC-DC converter, vehicle charger and so on. With the rapid development and popularization of new energy vehicles, the market of SiC power devices will continue to grow. In the first century, the electrification (EV) rate of cars is expanding rapidly. Hybrid vehicles, plug-in hybrid vehicles, pure electric vehicles and even fuel cell vehicles account for an increasing share of the market. 2035 is designated as the first year of termination of fuel car manufacturing by countries all over the world. Power electronics technology provides reliable high-voltage, high-current and high-power power control system, which determines the performance and safety of electric vehicles.

Memory

CPU /GPU

Sensor

New energy vehicle power control chip (Sic,GaN) applications include:

Invisible laser cutting technology is also the best choice for traditional silicon (Si) based chip industry.

After a long process of development, the precision machining technology and circuit forming process of silicon-based semiconductors have almost reached the limit of the characteristics of materials. In order to improve the operation speed, the chip itself is also developing towards micro-refinement and three-dimensional. [image processing chip (GPU)] and [central processing unit chip (CPU)] with complex integrated computing capabilities are typical representative products. Its complexity represents the forefront of the human semiconductor industry. GPU/CPU has the important characteristics of complex structure, large size and high product value. Silicon-based semiconductor materials are still the main materials, and the wafer size is also developing from 300mm to 450mm. The substitution process of the third generation semiconductor materials is also affected by process maturity and manufacturing cost. At present, it is impossible to replace silicon-based semiconductor materials. For a long time, silicon-based semiconductor wafers have been segmented by the mechanical cutting method of diamond hob. This separation method requires a large amount of pure water for cooling and carbon dioxide injection to produce DI water to eliminate electrostatic hazards. The waste water after cutting still needs to be treated. Compared with blade cutting, laser stealth cutting has a narrower cutting path, higher chip output of a single wafer, and no need for water and other consumables.

Stealth laser cutting technology is the best choice for new GPU and CPU industries with highly complex and three-dimensional processes.

Sensor

Automobile industry

Memory

At present, most of the memory based on silicon (Si) and semiconductor materials are cut by blades. However, with the "thinning" and "smaller" global market demand trend of semiconductor products, the demand for thinner wafers and smaller devices is growing day by day, and the traditional blade cutting has been unable to meet the cutting needs of ultra-thin wafers.

Sensor

Automobile industry

CPU/GPU

Process characteristics

The traditional memory wafer cutting process mainly depends on the combination of blade and laser cutting, which is applied to the single complex stack. Due to the laminated structure of materials with different densities in the memory, the use of blade cutting leads to a very high risk of layering. Even if the laser slotting + blade cutting process is used, it is difficult to safely divide the thin wafers below 50 μ m.

The best solution

Because the focus of laser modification can be freely controlled in the depth direction of the wafer, the cutting depth and thickness can be accurately controlled to achieve deterministic cutting such as single-focus, double-focus, multi-focus, or even full-cutting. The application of general intelligent laser stealth cutting technology is promoting the rapid upgrading of processing technology in memory industry.

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