Wafer cutting, also known as wafer segmentation, refers to the process of separating a single wafer from a larger semiconductor material (wafer).
The development of semiconductor wafer cutting technology has experienced two stages: mechanical cutter wheel cutting and surface laser ablation cutting, and the third stage of invisible laser cutting technology. Compared with the first and second stage cutting technology, the stealth laser cutting process is safer, more efficient and cleaner. Invisible laser cutting technology is very suitable for cutting semiconductor wafers with fragile structures such as MEMS.
General Intelligent Suzhou Technology Center is always equipped with a variety of invisible laser wafer cutting equipment and supporting equipment, which can provide efficient and reliable wafer cutting services for users in the semiconductor industry. We use our own technological advantages, using self-developed stealth cutting equipment and auxiliary equipment for high-precision slicing, cutting and slotting of silicon-based, silicon carbide and other materials wafers.
If your product is a sensitive semiconductor product that requires high cleanliness and low mechanical stress tolerance and cannot be cooled by DI water, general intelligent stealth laser cutting technology will be the best solution. We hope that through the cooperation with us, we can promote the customer's wafer design to further reduce the width of the cutting channel, increase the chip density, greatly improve the customer's chip output rate, and gain stronger competitiveness.
We sincerely look forward to working with all kinds of R & D departments, start-ups and colleges and universities to provide the most efficient and best wafer cutting services.
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