Low-K slotting equipment

HGL Series

Development of Low-K Semiconductors

HGL1151 series is a semiconductor wafer Low-K layer slotting equipment integrated with general intelligent core technology, automatic one-stop processing, wafer feeding → pre-cleaning + protective layer coating → laser slotting → cleaning + drying → wafer blanking, all processes are done in one go. The products are equipped with high-performance laser and space light shaping system, standard ultra-high precision air-floating high-speed machining platform, real-time monitoring and real-time deviation correction in the cutting process, to ensure the accuracy consistency and quality stability of Low-K wafer slotting. This product has high slotting precision and excellent groove shape, especially the control of heat-affected zone has reached the highest international standard. The main technical performance has reached the lead in China, and some of the technical performance is better than that of similar international products, so it is the best choice to completely replace the imported slotting equipment.

Advantages of Low-K laser slotting process

Non-contact processing, no physical stress, no risk of wafer fragmentation Through dynamic laser real-time control, the process setting is simple and flexible. ① freely changes the width of slotting ② freely sets the smoothness of the slot bottom Easy to use, low-cost ① once positioning, one-time cleaning ② process cleaning ③ has no environmental pollution. ④ basically has no consumables, and the operation cost is extremely low.

Low-K wafer slotting equipment station

Technical principle

Using high-performance spatial light shaping technology to modulate the output laser shape on demand both sides of the ① cutting path are depicted with very fine double beams the boundary slot is depicted by a flat-top multi-beam laser slotting on the inside of the boundary groove using high-performance real-time dynamic laser control technology to ensure the slotting accuracy. ① real-time control of machining accuracy of slotted wall verticality by laser beam ② real-time control of machining accuracy of groove bottom flatness by laser beam Accurate removal of Low-K materials by ultra-fast pulsed laser beam The heat affected zone around the slotting is controlled within 5 μ m.

Ultra-precision laser real-time shaping control system

Double-beam laser opening boundary slot

Multi-beam flat-top laser slotting

Low-K material slotting process

Low-k (low dielectric constant) material is a necessary insulating material for high performance integrated circuits whose linewidth process is lower than 65nm. Low-K material has fragile mechanical properties. Low-K materials and Si series materials have low adhesion, easy to peel off and easy to delaminate. Semiconductor wafers with Low-K layer can not withstand mechanical impact of traditional cutter wheel cutting wafers with Low-K material need to introduce Low-K slotting process before cutting to avoid damage to Low-K material layer caused by subsequent cutting process.

Verification of Low-K slotting process

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