Wafer cutting _ stealth cutting _ wafer laser cutting equipment _ semiconductor wafer cutting _ Henan General Intelligent equipment Co., Ltd.

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HGL series wafer laser stealth cutting equipment

HGL Series

Overview

With its rich experience in the development of automation equipment, laser processing technology and mastery of the characteristics of semiconductor materials, General Intelligence has taken the lead in developing HGL series of advanced semiconductor wafer laser stealth cutting equipment to break the international monopoly. After being reviewed by the national authority, it is determined that its "comprehensive performance has reached the international advanced level, and some of its performance is in the leading position in the world".

Product series

1

Single focus stealth cutting equipment

Bifocal stealth cutting equipment

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Single focus wafer laser stealth cutting equipment

Suitable for wafers

4 inches to 8 inches

Wafer thickness

3 μ m ~ 1000 μ m

Number of focus

1

HGL1341 series

Large size single focus wafer laser stealth cutting equipment

Suitable for wafers

4 inches to 12 inches

Wafer thickness

3 μ m ~ 1000 μ m

Number of focus

1

HGL1351 series

Suitable material

Applied industry

Single focus stealth cutting equipment

Single focus cutting

The depth of laser focus can be freely controlled.

The length of the focus can be freely controlled.

Universal bifocal large size wafer laser stealth cutting equipment

Suitable for wafers

4 inches to 12 inches

Wafer thickness

3 μ m ~ 1000 μ m

Number of focus

HGL1352 series

2

Suitable material

Applied industry

Bifocal stealth cutting equipment

Bifocal cutting

The depth of laser focus can be freely controlled.

The length of the focus can be freely controlled.

The horizontal interval between two focal points can be freely controlled.

Product advantage

01

Laser control core

Master all kinds of semiconductor and ceramic materials laser stealth cutting frequency spectrum and optimal laser output and control technology and other core technologies.