DC-41- mechanical splitter

HGL Series

Function description

This equipment is mainly used in the mechanical splitting process of all kinds of brittle materials (sapphire / glass / all kinds of semiconductor wafers). It is suitable for products up to 6 inches.

Mechanism characteristics

1

Fully automatic loading and unloading / processing structure of material box, perfect visual positioning system, full marble core moving parts, self-developed upper computer software, integrated motion control system.

Equipment advantage

It has upper and lower image and multi-light source, which is suitable for all kinds of fragment modes, high positioning accuracy, regional compensation function and high fragment yield.

DS-51- fully automatic integrated splitter

Function description

This equipment is mainly used for chip segmentation and DAF segmentation after stealth cutting of si-based materials, and DAF segmentation after DBG. It is suitable for 12-inch Frame products.

Mechanism characteristics

1

Automatic loading and unloading of material box, which integrates four processes: cold expansion, hot expansion, cleaning and UV

Equipment advantage

1. Four processes (cold expansion, hot expansion, cleaning, UV) can be combined arbitrarily by software.
2. The stable chip and DAF segmentation of the stealth cut wafer can be realized, which is an indispensable process in the SDBG process.
3. The tension and chip spacing of the expanded film can be ensured by thermal shrinkage, so there is no need to re-paste the cutting film and can be transported directly to the next stage of the patch process.

More Devic

Wafer stealth cutting equipment

Wafer tape ungluing equipment

Wafer expansion equipment

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