1. Four processes (cold expansion, hot expansion, cleaning, UV) can be combined arbitrarily by software.
2. The stable chip and DAF segmentation of the stealth cut wafer can be realized, which is an indispensable process in the SDBG process.
3. The tension and chip spacing of the expanded film can be ensured by thermal shrinkage, so there is no need to re-paste the cutting film and can be transported directly to the next stage of the patch process.