Cutting equipment 1: 20201228: 22233688
Monocrystalline silicon chip products for packaging
HGL Series
描述
With the rapid development of ultra-high-speed communications, new energy vehicles and artificial intelligence, it is an inevitable trend for the semiconductor industry to cope with integrated circuit chips such as low energy consumption, ultra-high response speed and high performance MEMS, as well as the third generation semiconductor power chips. The products processed by general intelligent wafer laser stealth processing equipment can meet the needs of chip packaging and testing enterprises and improve the quality rate and production efficiency of users.
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