Wafer cutting _ stealth cutting _ wafer laser cutting equipment _ semiconductor wafer cutting _ Henan General Intelligent equipment Co., Ltd.

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Accompanying strip products for laser bar end coating

HGL Series

Product use

Treatment Technology of Bar end face of Laser Diode

1. Treatment of laser bar emitter end: Facet passivation process Antireflective film process two。 Treatment of laser bar reflector end: Facet passivation process High reflectance (HR) coating to construct Bragg mirror structure

Stacking process before coating of laser diode bar bar

1. Before coating, the laser diode bar should be stacked in a special coating fixture. two。 The two sides of the stacked bar are exposed to the coating window of the fixture. 3. After coating, the laser bar is stacked and divided into separate bars.

Application of laser diode bar bar end-coated spacer

1. Usage: put an accompanying strip between two laser bars as an interval. two。 Strip material: monocrystalline silicon or the same material as bar bar 3. The function of silicon spacer: the spacer is longer than bar to provide mechanical stability for bar stack. The spacer is slightly narrower than the laser bar, which makes the end face of the laser bar slightly. Protruding into the coating cavity to obtain a better covering coating effect. It is convenient for the automatic disassembly machine to disassemble the bar stack to prevent the disassembly stack. The mirror coating is damaged in the process.

Manufacturing process

1. Product raw materials: Material name: high purity monocrystalline silicon wafer Material diameter: φ 150mm Material thickness: 110 μ m two。 Surface quality: Polished mirror / thinned grinding or polished mirror / polished mirror 3. Appearance quality: No bending, no deformation No collapse edge, no crack 4. Manufacturing process Invisible laser cutting Film expansion after cutting