1. Product raw materials:
Material name: high purity monocrystalline silicon wafer
Material diameter: φ 150mm
Material thickness: 110 μ m
two。 Surface quality:
Polished mirror / thinned grinding or polished mirror / polished mirror
3. Appearance quality:
No bending, no deformation
No collapse edge, no crack
4. Manufacturing process
Invisible laser cutting
Film expansion after cutting