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6 leading technologies
Stealth-Laser Wafer Dicing
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We Inspire the future
We drive the future.
Independent R & D breaks through bottlenecks and reshapes the industry pattern to drive the future with scientific and technological innovation, providing unlimited possibilities for semiconductor intelligent manufacturing
KEY TECHNOLOGIES
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15859969944472zpec
15859969944472zpec
15859969944472zpec
15859969944472zpec
Self-developed multi-frequency laser technology to meet the processing needs of a variety of materials Dynamic shaping of laser spot by spatial light modulation technology
Independent development of laser lens technology Self-designed laser optical path technology
Independently develop cutting software to realize automatic cutting EtherCAT bus control technology
PRODUCTS
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15859969944472zpec
ABOUT GIE
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The world's leading semiconductor equipment manufacturer
Henan General Intelligent equipment Co., Ltd., referred to as General Intelligence (CHN.GIE), is an international intelligent equipment manufacturing enterprise, the core R & D team is composed of technical experts led by doctors, and has a complete modern team of R & D design, manufacturing, operation management and so on. The company is committed to the R & D and manufacturing of high-end semiconductors, upstream and downstream industrial chain equipment and materials. General Intelligence has won word-of-mouth and trust among peers and customers with the enterprise spirit of "integrity, responsibility, team and innovation". We not only manufacture the world's leading laser invisible wafer cutting equipment, but also provide customers with a full range of process solutions and supporting personnel training services.
NEWS
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